Double-side flip-chip fabrication of intrinsic Josephson junctions

Students will make stacks of intrinsic Josephson junctions (IJJs) imbedded in the bulk of very thin (d ~ 100 nm) Bi₂Sr₂CaCu₂O_8+x single crystals. By precisely controlling the etching depth during the double-sided fabrication process, the stacks can be reproducibly tailor-made to be of any small height (0-9nm < d), i.e. enclosing any specified number of IJJ (0-6), including the important for practical applications case of single junction.

The work will include making photolithography, dry- and wet etching, and electric characterization at low temperatures.

Contact person: A.Yurgens, tel. 3474  <yurgens -et- mc2.chalmers.se>