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FABRICATION PROCESSES

 

E-Beam Processes | Wet Processes

Gold Pads |Loadpoint Diamond Saw |Bolometer Fabrication

 

Link to MC2 Webpage.

Loadpoint Manual | Loadpoint Programs

You may need ADOBE Acrobat Reader, which you can download here (Swedish) or here (US).

 

HOW TO USE THE DIAMOND SAW

 

  1. Turn on the water, air, vacuum, monitor and controller.

  2. Mount the saw.

  3. Prepare the wafer for cutting and mount it on the wafer stage.

  4. Push SPINDLE to start the wafer rotation. Wait about 10 seconds and then push HEIGHT SENSE. Always push HEIGHT SENSE after changing your program.

  5. Set the following parameters:

    1. Program 10 for silicon wafer.

    2. Metric 2.

    3. 21 for circular wafer and monodirectional cutting.

    4. Dimension A, B is 50 mm (2 inch wafer) or 80 mm (3 inch wafer).

    5. Wafer thickness is 325 mm (2 inch wafer) or 455 mm (3 inch wafer). The thicknesses already include the 75 mm blue tape thickness.

    6. Depth of cut is 0.300 mm through or 0.140 mm halfway (2 inch wafer), or 0.430 mm through or 0.230 mm halfway (3 inch wafer).

    7. Pitch A, B is 14.800 mm. One chip is 7 mm with 0.4 mm spacing between chips.

    8. Number of cuts is self-explanatory. A, B directions is invariant under rotation.

    9. Feed rate left, right is 10 mm/sec for silicon wafers.

    10. Spindle speed is 40000 rpm for silicon wafers.

  6. Push SAVE and BLANK to save the changes.

  7. Push PROG to go through program and ENTER to change parameters.

  8. Push INDEX to move down and REV INDEX to move up by the amount specified in PITCH.

  9. Push WATER or AIR JET to clean surface during and after cutting.

  10. Push CUT AUTO to start program or CUT SINGLE to make a single test cut.

  11. Push ROTATE button twice to rotate by 90 degrees.

  12. Push SPINDLE to stop rotation.

  13. Remove your sample and carefully cut it in pieces by applying as little force as possible.

  14. Turn off monitor, controller, vacuum, water and air.

            Clean up after you.

 

Updated: August 9, 2004, Ian Jasper Agulo

 

 
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